Friday, October 7, 2011

Junior Production Engineer-Job Code: CIK-2071

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For Address & Walk-In Interview Venue Details Go To Contact Page & Get Appointment.
Complete work according to documented instructions, in a tightly controlled environment.Qualify tools daily.Perform alignment and bonding of GaAs opto-electronic components.Handle chemicals used in the process.Test process results on stated parameters.Follow documentation and safety protocols.Maintain an organized and clean work area.
Stay current on revisions of the product.Work independently with minimal supervision.Cross train with Production Technicians.
Position Requirements
Related experience required. Must have knowledge of at least one of the following process areas:wire bonding,soldering, die bonding, opto-electronic device testing and burn in, or any relevant experience as a production technician in a GaAs wafer fab. Must have basic knowledge of SPC concepts. Must be able to work standing up for 8 hour shifts. Must be able to work independently and to demonstrate extremely high level of precision and accuracy.
Diploma in Mechanical,electrical,electronic and automobile technology or related field preferred.
Keywords:Mechanical Production Industrial